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0805R View Datasheet(PDF) - Unspecified

Part Name
Description
Manufacturer
0805R
ETC
Unspecified 
0805R Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
T
Technical Summary
W
Technical Information
Novacap provides application notes throughout this catalog
as a guide to chip selection and attachment methods. Refer
to the Novacap Technical Brochure found at www.novacap.
com for more details. This technical information includes
the nature of capacitance, dielectric properties, electrical
properties, classes of dielectrics, ferroelectric behavior, test
standards, and high reliability test plans. Please do not
hesitate to contact the sales office for any product or technical
assistance.
Capacitor Size
Size availability is based primarily on capacitance values and
voltage rating. Smaller units are generally less expensive.
Because mass affects the thermal shock susceptibility of chip
capacitors, size selection should consider the soldering method
used to attach the chip to the board. Sizes 1812 and smaller
can be wave, vapor phase, or reflow soldered. Larger units
require reflow soldering.
Chip Selection
Multilayer capacitors (MLC) are categorized by dielectric
performance with temperature. The Temperature Coefficient
of Capacitance describes the variance of capacitance value
with temperature. The choice of components is therefore
largely determined by the temperature stability required of the
device and the size necessary for the desired capacitance value
and voltage rating.
Packaging
Units are available reeled, in waffle pack, or bulk packaged.
Bar coded labels are standard for reeled and bulk packaging.
Primary Dielectric Types
MB
C0G/NP0:
Ultra stable Class I dielectric, with negligible dependence of
capacitance on temperature, voltage, frequency, and time.
Used in circuitry requiring very stable performance.
X7R:
Stable Class II dielectric, with predictable change in properties
across a temperature range of -55°C to +125°C. Used as
blocking, decoupling, bypassing, and frequency discriminating
elements. This dielectric is ferroelectric and provides higher
capacitance than Class I materials.
BX:
The military specification for ceramic chip capacitors (MIL-
PRF-55681) defines a mid-K stable dielectric designated as BX.
The BX specification has voltage temperature limits in addition
to temperature limits of capacitance. The BX dielectric is
limited to ±15% maximum change in capacitance between
25°C and -55°C or +125°C and also has a voltage restriction
of +15% / -25% maximum change in capacitance between
25°C and -55°C or +125°C at rated voltage.
Z5U/Y5V:
General purpose Class III dielectrics with higher dielectric
constant and greater variation of properties over temperature
and voltage. Very high capacitance per volume is attainable
for general purpose applications where stability over a wide
temperature range is not critical.
Dielectric
Termination
Combinations
Termination Material
We recommend the following
termination types:
Solder Attachment:
N Nickel Barrier, 100% matte
tin plated - RoHS
C FlexiCap™ with Nickel
Dielectric
RoHS RoHS RoHS
RoHS RoHS
RoHS
RoHS Barrier, 100% tin plated - RoHS
Code P PR K N Y NG C D B E S Y Nickel Barrier, tin-lead plated
C0G/NP0
R3L
N/RN
K
D FlexiCap™ Nickel Barrier,
tin-lead plated
X7R
B/RB
B Copper Barrier 100% matte
X7R BME
BB
tin plated - RoHS
X5R BME
BW
E Copper Barrier, tin-lead
BX
X
plated
Y5V
Y
Z5U
Z
C0G/NP0 (Mag free) M
X7R (Mag free)
C
K Solderable Palladium Silver -
RoHS (suitable for conductive epoxy attach)
S Solderable Silver - RoHS
X8R
S
Conductive Epoxy attachment:
C0G/NP0 (160ºC) F
P Palladium Silver
C0G/NP0 (200ºC) D
Class II (160ºC)
G
Class II (200ºC)
E
Pulse Power
P
PR Palladium Silver - RoHS
NG Nickel Barrier Gold Flash -
RoHS (suitable for soldering attach)
R2D
R
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