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SN74CBTLV3253PW View Datasheet(PDF) - Texas Instruments

Part NameSN74CBTLV3253PW TI
Texas Instruments TI
DescriptionLOW-VOLTAGE DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
SN74CBTLV3253PW Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SN74CBTLV3253
LOWĆVOLTAGE DUAL 1ĆOFĆ4 FET MULTIPLEXER/DEMULTIPLEXER
D Functionally Equivalent to QS3253
D 5-Switch Connection Between Two Ports
D Rail-to-Rail Switching on Data I/O Ports
SCDS039H − DECEMBER 1997 − REVISED OCTOBER 2003
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
1OE 1
S1 2
1B4 3
1B3 4
1B2 5
1B1 6
1A 7
GND 8
16 VCC
15 2OE
14 S0
13 2B4
12 2B3
11 2B2
10 2B1
9 2A
RGY PACKAGE
(TOP VIEW)
1
S1 2
1B4 3
1B3 4
1B2 5
1B1 6
1A 7
8
16
15 2OE
14 S0
13 2B4
12 2B3
11 2B2
10 2B1
9
description/ordering information
The SN74CBTLV3253 is a dual 1-of-4 high-speed FET multiplexer/demultiplexer. The low on-state resistance
of the switch allows connections to be made with minimal propagation delay.
The select (S0, S1) inputs control the data flow. The FET multiplexers/demultiplexers are disabled when the
associated output-enable (OE) input is high.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY
Tape and reel SN74CBTLV3253RGYR CL253
−40°C to 85°C
SOIC − D
SSOP (QSOP) − DBQ
Tube
Tape and reel
Tape and reel
SN74CBTLV3253D
SN74CBTLV3253DR
SN74CBTLV3253DBQR
CBTLV3253
CL253
TSSOP − PW
Tape and reel SN74CBTLV3253PWR CL253
TVSOP − DGV
Tape and reel SN74CBTLV3253DGVR CL253
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
1
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