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NX25F011B View Datasheet(PDF) - Unspecified

Part NameDescriptionManufacturer
NX25F011B 1M-BIT, 2M-BIT, AND 4M-BIT SERIAL FLASH MEMORIES WITH 4-PIN SPI INTERFACE ETC1
Unspecified 
NX25F011B Datasheet PDF : 37 Pages
First Prev 31 32 33 34 35 36 37
NX25F011B
NX25F021B
NX25F041B
PACKAGING INFORMATION
200-mil Plastic SOIC
Package Code: (S)
1
N
2
EH
3
4
1
D
SEATING PLANE
A
5
B
e
A1
L
=
C
6
7
200 mil Plastic SOIC (S)
Symbol
No. Leads
A
A1
B
C
D
E
e
H
L
α
Millimeters
Min
Max
8
1.780 2.030
0.102 0.330
0.305 0.508
0.178 0.254
5.160 5.380
5.210 5.410
1.27BSC
7.62 8.38
0.508
0o
0.889
8o
Inches
Min
Max
0.070 0.080
0.004 0.013
0.012 0.020
0.007 0.010
0.203 0.212
0.205 0.213
0.050 BSC
0.300 0.330
0.020
0o
0.035
8o
8
9
Notes:
1. Controlling dimensions: inches, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
protrusions and should be measured from the
bottom of the package.
4. Formed leads shall be planar with respect to one
another within .0004 inches at the seating plane.
10
11
12
NexFlash Technologies, Inc.
33
PRELIMINARY NXSF016F-1201
12/12/01 ©
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