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MSA-1000 View Datasheet(PDF) - HP => Agilent Technologies

Part Name
Description
Manufacturer
MSA-1000
HP
HP => Agilent Technologies HP
MSA-1000 Datasheet PDF : 4 Pages
1 2 3 4
Typical Performance, TA = 25°C
(unless otherwise noted)
10
40
0.5 GHz
8
36
IP3
6
32
2.0 GHz
1.0 GHz
4
1.5 GHz
28
2
24
P1 dB
0
16 18 20 22 24 26 28 30 32
POWER OUT (dBm)
Figure 1. Typical Gain vs. Power Out,
ZO = 25 , Id = 325 mA.
20
20
150 200 250 300 350 400
Id (mA)
Figure 2. Output Power at 1 dB Gain
Compression, Third Order Intercept
Point vs. Current, ZO = 25 ,
f=1.0GHz.
32
30
28
0.5 GHz
26
1.0 GHz
24
1.0 GHz,
22
4.0 GHz
2.0 GHz
20
–50
+25
+100
TEMPERATURE (°C)
Figure 3. Output Power at 1 dB Gain
Compression vs. Case Temperature,
ZO = 25 , Id = 325 mA.
16
12
ZO = 50
8
Closed Loop
4 Open Loop
0
0.1 0.2 0.3 0.5
1.0 2.0 3.0
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency,
Id = 325 mA.
MSA-1000 Bonding Diagram
Input Trace
Capacitor
(80 pF typ)
MSA Die
4
2
212
23
A10
Output
Trace
(backside
contact)
Ground
Numbers refer to pin contacts listed on the Chip Outline.
MSA-1000 Chip Dimensions
3
1
4
2
2
AK
2
2
495 µm
19.5 mil
917 µm
36.1 mil
Unless otherwise specified, tolerances are ±13 µm/±0.5 mils.
Chip thickness is 114 µm/4.5 mil. Bond Pads are 41 µm/1.6 mil
typical on each side.
Note 1: Output contact is made by die attaching the backside
of the die.
6-445
 

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