MMBT2222ALT3G View Datasheet(PDF) - ON Semiconductor
Part Name
Description
Manufacturer
MMBT2222ALT3G Datasheet PDF : 8 Pages
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MMBT2222LT1, MMBT2222ALT1
A
L
3
BS
1
2
V
G
C
D
H
PACKAGE DIMENSIONS
SOT−23 (TO−236AB)
CASE 318−08
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
K
J
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.1102 0.1197 2.80 3.04
B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
J 0.0034 0.0070
K 0.0140 0.0285
L 0.0350 0.0401
S 0.0830 0.1039
V 0.0177 0.0236
0.89
0.37
1.78
0.013
0.085
0.35
0.89
2.10
0.45
1.11
0.50
2.04
0.100
0.177
0.69
1.02
2.64
0.60
STYLE 6:
PIN 1.
2.
3.
BASE
EMITTER
COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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