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AM29LV160BB-80FIB View Datasheet(PDF) - Advanced Micro Devices

Part Name
Description
Manufacturer
AM29LV160BB-80FIB Datasheet PDF : 46 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
PRELIMINARY
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
AM29LV160B T 80R E C
OPTIONAL PROCESSING
Blank = Standard Processing
B = Burn-in
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)
PACKAGE TYPE
E = 48-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 048)
F = 48-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR048)
S = 44-Pin Small Outline Package (SO 044)
WC = 48-ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top Sector
B = Bottom Sector
DEVICE NUMBER/DESCRIPTION
Am29LV160B
16 Megabit (2M x 8-Bit/1M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations
AM29LV160BT80R,
AM29LV160BB80R
EC, FC, SC, WCC
AM29LV160BT90,
AM29LV160BB90
AM29LV160BT120,
AM29LV160BB120
EC, EI, EE,
FC, FI, FE,
SC, SI, SE,
WCC, WCI, WCE
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
Am29LV160B
7
 

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