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LM1084ISX-3.3/NOPB View Datasheet(PDF) - Texas Instruments

Part NameLM1084ISX-3.3/NOPB TI
Texas Instruments TI
Description5-A Low Dropout Positive Regulators
LM1084ISX-3.3/NOPB Datasheet PDF : 29 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
LM1084
SNVS037G – SEPTEMBER 1999 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
Maximum Input to Output Voltage Differential
LM1084-ADJ
LM1084-3.3
LM1084-5.0
Power Dissipation(3)
Junction Temperature (TJ)(4)
Lead Temperature
Storage temperature, Tstg
MIN
MAX
UNIT
29
V
27
V
25
V
Internally Limited
150
°C
260, to 10 sec
°C
–65
150
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the
test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery.
(4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
Junction Temperature Range (TJ)(2)
Control Section
Output Section
MIN
MAX
UNIT
–40
125
°C
–40
150
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the
test conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.4 Thermal Information
THERMAL METRIC(1)
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance: Control Section/Output
Section
LM1084
KTT
NDE
3 PINS
3 PINS
40.4
22.7
42.6
15.5
23.0
4.1
9.8
2.1
22.0
4.1
0.65/2.7
0.65/2.7
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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