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LM1084ISX-3.3/NOPB View Datasheet(PDF) - Texas Instruments

Part NameLM1084ISX-3.3/NOPB TI
Texas Instruments TI
Description5-A Low Dropout Positive Regulators
LM1084ISX-3.3/NOPB Datasheet PDF : 29 Pages
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LM1084
SNVS037G – SEPTEMBER 1999 – REVISED JANUARY 2015
www.ti.com
9 Power Supply Recommendations
The linear regulator input supply should be well regulated and kept at a voltage level such that the maximum
input to output voltage differential allowed by the device is not exceeded. The minimum dropout voltage (VIN
VOUT) should be met with extra headroom when possible in order to keep the output well regulated. A 10 μF or
higher capacitor should be placed at the input to bypass noise.
10 Layout
10.1 Layout Guidelines
For the best overall performance, some layout guidelines should be followed. Place all circuit components on the
same side of the circuit board and as near as practical to the respective linear regulator pins. Traces should be
kept short and wide to reduce the amount of parasitic elements into the system. The actual width and thickness
of traces will depend on the current carrying capability and heat dissipation required by the end system. An array
of plated vias can be placed on the pad area underneath the TAB to conduct heat to any inner plane areas or to
a bottom-side copper plane.
10.2 Layout Example
Figure 28. Layout Example
10.3 Thermal Considerations
ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how
well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and
ambient (θJA). Thermal resistance has units of temperature per power (C/W). The higher the thermal resistance,
the hotter the IC.
The LM1084 specifies the thermal resistance for each package as junction to case (θJC). In order to get the total
resistance to ambient (θJA), two other thermal resistance must be added, one for case to heat-sink (θCH) and one
for heatsink to ambient (θHA). The junction temperature can be predicted as follows:
TJ = TA + PD (θJC + θCH + θHA) = TA + PD θJA
(3)
TJ is junction temperature, TA is ambient temperature, and PD is the power consumption of the device. Device
power consumption is calculated as follows:
20
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