The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Winbond has been advised of the possibility of such damages.
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipments
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products
could result or lead to a situation wherein personal injury, death or severe property or environmental injury could occur.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published in the
Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates
This datasheet is subject to change without notice.
Information contained in this Winbond ChipCorder® datasheet supersedes all data for the ISD® ChipCorder® products
published by ISD® prior to August 1998.
This datasheet and any future addendum to this data sheet is (are) the complete and controlling ISD® ChipCorder®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information in
this, the information contained herein supersedes and governs such other information in its entirety.
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ISD® and ChipCorder® are registered
trademarks of Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All
other trademarks are properties of their respective owners.
No. 4, Creation Rd. III
Science-Based Industrial Park,
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
Winbond Electronics (Shanghai) Ltd.
27F, 299 Yan An W. Rd. Shanghai,
9F, No. 480, Pueiguang Rd.
Taipei, 114 Taiwan
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG. 3-7-18
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
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Publication Release Date: March 28, 2005