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HUFA76439P3T View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
HUFA76439P3T Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Data Sheet
HUFA76439P3, HUFA76439S3S
July 2002
71A, 60V, 0.014 Ohm, N-Channel, Logic
Level UltraFETĀ® Power MOSFET
Packaging
JEDEC TO-220AB
JEDEC TO-263AB
SOURCE
DRAIN
GATE
DRAIN
(FLANGE)
DRAIN
(FLANGE)
HUFA76439P3
GATE
SOURCE
HUFA76439S3S
Symbol
D
G
S
Features
ā€¢ Ultra Low On-Resistance
- rDS(ON) = 0.012ā„¦, VGS = 10V
- rDS(ON) = 0.014ā„¦, VGS = 5V
ā€¢ Simulation Models
- Temperature Compensated PSPICEĀ® and SABERā„¢
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
ā€¢ Peak Current vs Pulse Width Curve
ā€¢ UIS Rating Curve
ā€¢ Switching Time vs RGS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
HUFA76439P3
TO-220AB
76439P
HUFA76439S3S
TO-263AB
76439S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA76439S3ST.
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
HUFA76439P3, HUFA76439S3S
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS
60
V
Drain to Gate Voltage (RGS = 20kā„¦) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
60
V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS
Ā±16
V
Drain Current
Continuous
Continuous
Continuous
Continuous
(TC
(TC
(TC
(TC
=
=
=
=
22115500oo00CCooCC,, ,,VVVVGGGGSSSS====5154V0.VV)5))V.()F.. (i..gF..uig..rue.. r..2e..)2.. )...
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.ID
.ID
.ID
.ID
71
75
50
48
A
A
A
A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Figure 4
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Figures 6, 17, 18
Power Dissipation . . .
Derate Above 25oC
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PD
..
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
NOTES:
1. TJ = 25oC to 150oC.
155
1.04
-55 to 175
300
260
W
W/oC
oC
oC
oC
CAUTION: Stresses above those listed in ā€œAbsolute Maximum Ratingsā€ may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
Ā©2002 Fairchild Semiconductor Corporation
HUFA76439P3, HUFA76439S3S Rev. B1
 

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