FS6070-01 View Datasheet(PDF) - AMI Semiconductor
Part Name
Description
Manufacturer
FS6070-01 Datasheet PDF : 7 Pages
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AMERICAN MICROSYSTEMS, INC.
October 2000
FS6070-01
1:4 HSTL to LVTTL Fanout Buffer IC
Preliminary Information
3.0 Package Information
Table 8: 16-pin SOIC (0.150") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN. MAX. MIN. MAX.
A 0.061 0.068 1.55 1.73
A1 0.004 0.0098 0.102 0.249
A2 0.055 0.061 1.40 1.55
B 0.013 0.019 0.33 0.49
C 0.0075 0.0098 0.191 0.249
D 0.386 0.393 9.80 9.98
E 0.150 0.157 3.81 3.99
e
0.050 BSC
1.27 BSC
H 0.230 0.244 5.84 6.20
h 0.010 0.016 0.25 0.41
L 0.016 0.035 0.41 0.89
Θ
0°
8°
0°
8°
16
R
AMERICAN MICROSYSTEMS, INC.
EH
1
B
BASE PLANE
e
D
ALL RADII:
0.005" TO 0.01"
A2 A
C
A1
SEATING PLANE
h x 45°
L
7° typ.
θ
Table 9: 16-pin SOIC (0.150") Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
SYMBOL
ΘJA
L11
L12
C11
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Corner lead
Center lead
Any lead to any adjacent lead
Any lead to VSS
TYP.
109
4.0
3.0
0.4
0.5
UNITS
°C/W
nH
nH
pF
ISO9001
QS9000
5
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