LPC920F View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
LPC920F Datasheet PDF : 45 Pages
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Philips Semiconductors
P89LPC920/921/922
8-bit microcontrollers with two-clock 80C51 core
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
15. Revision history
Table 13: Revision history
Rev Date
CPCN
Description
06 20031121 -
Product data (9397 750 12285); ECN 853-2403 01-A14557 of 18 November 2003
Modification:
• Table 8 “DC electrical characteristics” on page 35: ITL VIN conditions, changed value from
1.5 V to 2.0 V
05 20031007 -
Product data (9397 750 12121); ECN 853-2403 30391 of 30 September 2003
04 20030909 -
Product data (9397 750 11945); ECN 853-2403 30305 of 5 September 2003
03 20030811 -
Preliminary data (9397 750 11786)
02 20030522 -
Objective data (9397 750 11532)
01 20030505 -
Preliminary data (9397 750 11387)
9397 750 12285
Product data
Rev. 06 — 21 November 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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