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AP1510SG-13_17 View Datasheet(PDF) - Diodes Incorporated.

Part NameAP1510SG-13_17 Diodes
Diodes Incorporated. Diodes
DescriptionPWM CONTROL 3A STEP-DOWN CONVERTER
AP1510SG-13_17 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
AP1510
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VCC
VCC Pin Voltage
VSS - 0.3 to VSS + 25
V
VFB
FB Pin Voltage
VSS - 0.3 to VCC
V
VEN
EN Pin Voltage
VSS - 0.3 to VIN + 0.3
V
VOUT
Output Pin Voltage
VSS - 0.3 to VIN + 0.3
V
PD
Power Dissipation
Internally Limited
mW
TOP
Operating Junction Temperature Range
-20 to +125
°C
TST
Storage Temperature Range
-65 to +150
°C
Caution: The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded
under any conditions.
Recommended Operating Conditions
Symbol
VIN
IOUT
TA
Parameter
Input Voltage
Output Current
Operating Ambient Temperature
Min
Max
Unit
3.6
23
V
0
3
A
-25
+85
°C
Electrical Characteristics (VIN = 12V, TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Conditions
VFB Feedback Voltage
IOUT = 0.1A
IFB Feedback Bias Current
IOUT = 0.1A
ISW Switch Current
ISHDN
VOUT
/VIN
VOUT
/VOUT
fOSC
fOSC1
Current Consumption During Power Off
Line Regulation
Load Regulation
Oscillation Frequency
Frequency of Current Limit or Short
Circuit Protect
VEN = 0V
VIN = 5V to 23V, IOUT = 0.2A
IOUT = 0.1 to 3A
Measure waveform at Output pin
Measure waveform at Output pin
VIH
EN Pin Input Voltage
VIL
Evaluate oscillation at Output pin
Evaluate oscillation stop at Output pin
IENH
EN Pin Input Leakage Current
IENL
IOCSET OCSET Pin Bias Current
tSS Soft-Start Time
TSHDN Thermal Shutdown Threshold
THYS Thermal Shutdown Hysteresis
RDSON
EFFI
θJA
Internal MOSFET RDSON
VIN = 5V, VFB = 0V
VIN = 12V, VFB = 0V
Efficiency
VIN = 12V, VOUT = 5V
IOUT = 3A
Thermal Resistance Junction-to-Ambient SO-8 (Note 4)
θJC Thermal Resistance Junction-to-Case SO-8 (Note 4)
Min
Typ
0.784
0.8
0.1
3.5
10
1
0.2
240
300
10
2.0
20
-10
75
90
0.3
2
+150
+55
110
70
91
134
22
Note:
4. Test condition: Device mounted on FR-4 substrate 2oz copper, minimum recommended pad layout, single side.
For better thermal performance, please arrange larger copper pad of layout for heatsink.
AP1510
Document number: DS31018 Rev. 8 - 2
3 of 9
www.diodes.com
Max
0.816
0.5
2
0.5
360
0.8
105
5
150
100
Unit
V
µA
A
µA
%
%
kHz
kHz
V
µA
µA
µA
ms
°C
°C
mΩ
%
°C/W
°C/W
December 2017
© Diodes Incorporated
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