NNCD3.3B to NNCD12B
TYPICAL CHARACTERISTICS (TA = 25 °C)
Fig. 1 POWER DISSIPATION vs.
AMBIENT TEMPERATURE
600
500
= 5 mm
400
= 10 mm
300
10 mm
200 P.C Board φ 3 mm
t = 0.035 mm
100
P.C Board
7 mm
t = 0.035 mm
0
0 20 40 60 80 100 120 140 160 180 200
TA - Ambient Temperature - °C
Fig. 3 IT - VBR CHARACTERISTICS
NNCD5.6B TA = 25 °C NNCD6.8B
NNCD5.1B
TYP.
NNCD6.2B
100 m
NNCD7.5B
NNCD8.2B
NNCD3.3B
NNCD3.6B
NNCD9.1B
10 m NNCD3.9B
NNCD4.3B
NNCD4.7B
1m
Fig. 2 THERMAL RESISTANCE vs.
SIZE OF P.C BOARD
600
Junction to
anbient
500
400
S
300
= 10 mm
200
= 5 mm
100
0
0
20
40
60
80
100
S - Size of P.C Board - mm2
Fig. 4 IT - VBR CHARACTERISTICS
100 m
10 m
TA = 25 °C
TYP.
NNCD11B
NNCD10B NNCD12B
1m
100 µ
100 µ
10 µ
10 µ
1µ
1µ
100 n
100 n
10 n
10 n
1n
0123456789
VBR - Breakdown Voltage - V
1n
0
7 8 9 10 11 12 13 14 15
VBR - Breakdown Voltage - V
3