TDA1170S View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TDA1170S

TV VERTICAL DEFLECTION

STMicroelectronics 

TDA1170S

MOUNTING INSTRUCTION

The junction to ambient thermal resistance of the

TDA 1170S can be reduced by soldering the tabs

to a suitable copper area of the printed circuit board

(fig. 4) or to an external heatsink (fig. 5).

Figure 4 : Example of P.C Board Copper Are

is Used as Heatsink

The diagram of fig. 6 shows the maximum dissipa-

ble power Ptot and the Rth j-amb as a function of the

side ”s” of two equal square copper areas having

a thickness of 35 µ (1.4 mil).

Figure 5 : Example with External Heatsink

Figure 6 : Maximum Power Dissipation and

Junction-Ambient Thermal

Resistance versus ”S”

Figure 7 : Maximum Allowable Power

Dissipation versus Ambient

Temperature

8/9

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