Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

HMC259 查看數據表(PDF) - Hittite Microwave

零件编号产品描述 (功能)生产厂家
HMC259 GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 28 - 40 GHz Hittite
Hittite Microwave Hittite
HMC259 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v01.0801
MICROWAVE CORPORATION
HMC259
GaAs MMIC SUB-HARMONICALLY
PUMPED MIXER, 28 - 40 GHz
MMIC Assembly Techniques for HMC259
5
Mounting & Bonding Techiniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground
plane eutectically or with conductive epoxy (see HMC
general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm
(5 mil) thick alumina thin film substrates are rec-
ommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film
substrates must be used, the die should be raised
0.150mm (6 mils) so that the surface of the die is
coplanar with the surface of the substrate. One way
to accomplish this is to attach the 0.102mm (4 mil)
thick die to a 0.150mm (6 mil) thick molybdenum heat
spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
Figure 3: Typical HMC259 Assembly
Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length.
Typical die-to-substrate spacing is 0.076mm (3 mils).
5 - 124
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
Direct download click here

 

Share Link : 
All Rights Reserved© datasheetq.com 2015 - 2020  ] [ Privacy Policy ] [ Request Datasheet  ] [ Contact Us ]