GE28F400B3T90 View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

GE28F400B3T90

3 Volt Advanced Boot Block Flash Memory

Intel 

28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

2.0

Product Description

This section explains device pin description and package pinouts.

2.1

Package Pinouts

The 3 Volt Advanced Boot Block flash memory is available in 40-lead TSOP (x8, Figure 1),

48-lead TSOP (x16, Figure 2) and 48-ball µBGA(x8 and x16, Figure 3 and Figure 4, respectively)

and 48-ball VF BGA (x16, Figure 4) packages. In all figures, pin changes necessary for density

upgrades have been circled.

Figure 1. 40-Lead TSOP Package for x8 Configurations

A16

1

40

A17

A15

2

39

GND

A14

3

38

A20

16 M

A13

4

A12

5

37

36

A19

A10

8M

A11

6

35

DQ7

A9

7

34

DQ6

A8

8

Advanced Boot Block

33

DQ5

WE#

9

40-Lead TSOP

32

DQ4

RP#

10

10 mm x 20 mm

31

VCCQ

VPP

11

30

VCC

WP#

12

4M

A18

13

TOP VIEW

29

NC

28

DQ3

A7

14

27

DQ2

A6

15

26

DQ1

A5

16

25

DQ0

A4

17

24

OE#

A3

18

23

GND

A2

19

22

CE#

A1

20

21

A0

NOTES:

0580_01

1. 40-Lead TSOP available for 8- and 16-Mbit densities only.

2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on

Pin 38.

3UHOLPLQDU\

3

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