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GE28F400B3T70 View Datasheet(PDF) - Intel

Part NameGE28F400B3T70 Intel
Intel Intel
Description3 Volt Advanced Boot Block Flash Memory
GE28F400B3T70 Datasheet PDF : 58 Pages
First Prev 41 42 43 44 45 46 47 48 49 50 Next Last
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Ordering Information Valid Combinations
40-Lead TSOP
48-Ball µBGA* CSP(1,2)
48-Lead TSOP
Ext. Temp.
64 Mbit
Ext. Temp.
32 Mbit
Ext. Temp.
16 Mbit
Ext. Temp.
8 Mbit
Ext. Temp
4 Mbit
TE28F016B3TA90(3)
TE28F016B3BA90(3)
TE28F016B3TA110(3)
TE28F016B3BA110(3)
TE28F008B3TA90(3)
TE28F008B3BA90(3)
TE28F008B3TA110(3)
TE28F008B3BA110(3)
TE28F004B3T90
TE28F004B3B90
TE28F004B3T110
TE28F004B3B110
GT28F016B3TA90(3)
GT28F016B3BA90(3)
GT28F016B3TA110(3)
GT28F016B3BA110(3)
GT28F008B3T90
GT28F008B3B90
GT28F008B3T110
GT28F008B3B110
TE28F640B3TC90
TE28F640B3BC90
TE28F640B3TC100
TE28F640B3BC100
TE28F320B3TC70
TE28F320B3BC70
TE28F320B3TC90
TE28F320B3BC90
TE28F320B3TA100
TE28F320B3BA100
TE28F320B3TA110
TE28F320B3BA110
TE28F160B3TC70
TE28F160B3BC70
TE28F160B3TC80
TE28F160B3BC80
TE28F160B3TA90(3)
TE28F160B3BA90(3)
TE28F160B3TA110(3)
TE28F160B3BA110(3)
TE28F800B3TA90(3)
TE28F800B3BA90(3)
TE28F800B3TA110(3)
TE28F800B3BA110(3)
TE28F400B3T90
TE28F400B3B90
TE28F400B3T110
TE28F400B3B110
48-Ball µBGA CSP(1,2)
GT28F640B3TC90
GT28F640B3BC90
GT28F640B3TC100
GT28F640B3BC100
GT28F320B3TA100
GT28F320B3BA100
GT28F320B3TA110
GT28F320B3BA110
GT28F160B3TA90(3)
GT28F160B3BA90(3)
GT28F160B3TA110(3)
GT28F160B3BA110(3)
GT28F800B3T90
GT28F800B3B90
GT28F800B3T110
GT28F800B3B110
48-Ball VF BGA
GE28F320B3TC70
GE28F320B3BC70
GE28F320B3TC90
GE28F320B3BC90
GE28F160B3TC70
GE28F160B3BC70
GE28F160B3TC80
GE28F160B3BC80
GE28F800B3TA90
GE28F800B3BA90
GE28F008B3TA90
GE28F008B3BA90
NOTES:
1. The 48-ball µBGA package top side mark reads F160B3 [or F800B3]. This mark is identical for both x8 and
x16 products. All product shipping boxes or trays provide the correct information regarding bus architecture.
However, once the devices are removed from the shipping media, it may be difficult to differentiate based on
the top side mark. The device identifier (accessible through the Device ID command: see Section 3.2.2 for
further details) enables x8 and x16 µBGA package product differentiation.
2. The second line of the 48-ball µBGA package top side mark specifies assembly codes. For samples only, the
first character signifies either “E” for engineering samples or “S” for silicon daisy chain samples. All other
assembly codes without an “E” or “S” as the first character are production units.
3. Product can be ordered in either 0.25 µm or 0.4 µm material. The “A” before the access speed specifies
0.25 µm material. For new designs, Intel recommends using 0.25 µm Advanced Boot Block devices.
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35
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