GE28F800B3B110 View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

GE28F800B3B110

3 Volt Advanced Boot Block Flash Memory

Intel 

28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3

Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View,

Ball Down)

1

2

3

4

5

6

7

8

16M

A

A13

A11

A8

VPP

WP#

A19

A7

A4

B

A14

A10

WE#

RP#

A18

A17

A5

A2

64M

32M

C

A15

A12

A9

A21

A20

A6

A3

A1

D

A16

D14

D5

D11

D2

D8

CE#

A0

E

VCCQ

D15

D6

D12

D3

D9

D0

GND

F GND

D7

D13

D4

VCC

D10

D1

OE#

NOTES:

0580_03

1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the

upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the

16-Mbit device. A20 is the upgrade address for the 32-Mbit device. A21 is the upgrade address for the 64-Mbit

device.

2. 4-Mbit density not available in µBGA CSP.

Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6 details the usage of each device

pin.

3UHOLPLQDU\

5

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