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GE28F400B3BA90 View Datasheet(PDF) - Intel

Part NameGE28F400B3BA90 Intel
Intel Intel
Description3 Volt Advanced Boot Block Flash Memory
GE28F400B3BA90 Datasheet PDF : 58 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and µBGA* Chip Size Package (Top View,
Ball Down)
1
2
3
4
5
6
7
8
16M
A
A13
A11
A8
VPP
WP#
A19
A7
A4
B
A14
A10
WE#
RP#
A18
A17
A5
A2
64M
32M
C
A15
A12
A9
A21
A20
A6
A3
A1
D
A16
D14
D5
D11
D2
D8
CE#
A0
E
VCCQ
D15
D6
D12
D3
D9
D0
GND
F GND
D7
D13
D4
VCC
D10
D1
OE#
NOTES:
0580_03
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the
16-Mbit device. A20 is the upgrade address for the 32-Mbit device. A21 is the upgrade address for the 64-Mbit
device.
2. 4-Mbit density not available in µBGA CSP.
Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6 details the usage of each device
pin.
3UHOLPLQDU\
5
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