GE28F640B3TA80 View Datasheet(PDF) - Intel
Part Name
Description
Manufacturer
GE28F640B3TA80 Datasheet PDF : 58 Pages
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28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Figure 2. 48-Lead TSOP Package for x16 Configurations
A15
1
A14
2
A13
3
A12
4
A11
5
A10
6
A9
7
64 M
32 M
A8
A21
A20
8
9
10
WE#
11
RP#
12
VPP
13
WP#
14
16 M
A19
15
A18
16
A17
17
A7
18
A6
19
A5
20
A4
21
A3
22
A2
23
A1
24
Advanced Boot Block
48-Lead TSOP
12 mm x 20 mm
TOP VIEW
48
A16
47
VCCQ
46
GND
45
DQ15
44
DQ7
43
DQ14
42
DQ6
41
DQ13
40
DQ5
39
DQ12
38
DQ4
37
VCC
36
DQ11
35
DQ3
34
DQ10
33
DQ2
32
DQ9
31
DQ1
30
DQ8
29
DQ0
28
OE#
27
GND
26
CE#
25
A0
0580_02
NOTE: Lower densities will have NC on the upper address pins. For example, an 16-Mbit device will have NC
on Pins 9 and 10.
Figure 3. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
1
2
3
4
5
6
7
8
16M
A
A14
A12
A8
VPP
WP#
A20
A7
A4
8M
B
A15
A10
WE# RP#
A19
A18
A5
A2
C
A16
A13
A9
A6
A3
A1
D
A17
NC
D5
NC
D2
NC
CE#
A0
E
VCCQ
A11
D6
NC
D3
NC
D0
GND
F GND
D7
NC
D4
VCC
NC
D1
OE#
NOTES:
0580_04
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
upper address solder balls. Routing is not recommended in this area. A20 is the upgrade address for the
16-Mbit device.
2. 4-Mbit density not available in µBGA* CSP.
4
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