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PACKAGE DIMENSIONS in millimeters (inches): MicroMELF
Cathode indification
1 (0.039) surface plan
MCL4151
Vishay Semiconductors
*
2 (0.079)
1.8 (0.071)
0.25 (0.010)
0.15 (0.006)
* The gap between plug and glass can
be either on cathode or anode side
> R2.5 (0.098)
glass
Foot print recommendation:
Reflow soldering
2.4 (0.094)
0.8 (0.031)
0.8 (0.031)
Wave soldering
2.8 (0.110)
0.9 (0.035)
0.9 (0.035)
Created - Date: 26.July.1996
Rev. 13 - Date: 07.June.2006
Document no.:6.560-5007.01-4
96 12072
0.8 (0.031)
1 (0.039)
Rev. 2.0, 14-Jul-17
3
Document Number: 85567
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