TS922IJT View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TS922IJT Datasheet PDF : 24 Pages
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Package information
TS922, TS922A
5.1
8-bump Flip-chip package information
Figure 14. 8-bump Flip-chip package dimensions (top view)
1. Die size: 1600 μm x 1600 μm ±30 μm
Die height: 350 µm ±20 µm
Die height (including bumps): 650 µm
Bump diameter: 315 µm ±50 µm
Bump height: 250 µm ±40 µm
Pitch: 500 µm ±10 µm
Backcoating
Figure 15. 8-bump Flip-chip footprint recommendation
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DocID5150 Rev 11
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