LTC1050ACN8 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LTC1050ACN8 Datasheet PDF : 16 Pages
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LTC1050
PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
0.040
(1.016)
MAX
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.016 – 0.021**
(0.406 – 0.533)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
** FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
REFERENCE
PLANE
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.200
(5.080)
TYP
H8(TO-5) 0.200 PCD 1197
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.300 BSC
(0.762 BSC)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
0.045 – 0.065
(1.143 – 1.651)
0.014 – 0.026
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.200
(5.080)
MAX
0.005
(0.127)
MIN
0.015 – 0.060
(0.381 – 1.524)
0.025
(0.635)
RAD TYP
0.100
(2.54)
BSC
0.125
3.175
MIN
OBSOLETE PACKAGES
0.405
(10.287)
MAX
8
7
65
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
J8 1298
1050fb
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