P4SMAJ13C View Datasheet(PDF) - Micro Commercial Components
Part Name
Description
Manufacturer
P4SMAJ13C Datasheet PDF : 6 Pages
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MCC
omponents
21201 Itasca Street Chatsworth
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Features
• For Surface Mount Applications
• Unidirectional And Bidirectional
• Low Inductance
• High Temp Soldering: 250°C for 10 Seconds At Terminals
• For Bidirectional Devices Add “C” To The Suffix Of The Part
Number: i.e. P4SMAJ5.0C or P4SMAJ5.0CA for 5% Tolerance
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• Case: JEDEC DO-214AC
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: Indicated by cathode band except bi-directional types
P4SMAJ5.0
THRU
P4SMAJ170CA
400 Watt
Transient Voltage
Suppressors
5.0 to 170 Volts
DO-214AC
(SMAJ)( LEAD FRAME)
A
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• Operating Temperature: -55°C to +150°C
: • Storage Temperature: -55°C to +150°C
• Typical Thermal Resistance: 25 /W Junction to Ambient
V :DYHIRUP Peak Pulse Current on
10/1000
IPPM See Table 1 Note 1
Peak Pulse Power Dissipation PPPM Min 400 W Note 1, 5
Steady State Power Dissipation PM(AV)
1.0 W Note 2, 4
Peak Forward Surge Current
IFSM
40A Note:4
: Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above
TA=25 per Fig.2.
2. Mounted on 5.0mm2 copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle = 4 pulses per
Minutes maximum.
: 4. Lead temperature at TL = 75 .
V 5. Peak pulse power waveform is 10/1000 .
B
C
F
H
D
G
E
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.157
.181
B
.098
.114
C
.006
.012
D
.030
.060
E
.188
.208
F
.078
.096
G
.055
.062
H
.002
.008
MM
MIN
4.00
2.50
0.152
0.76
4.80
2.00
1.40
0.051
MAX
4.60
2.90
0.305
1.. 52
5.28
2.44
1.60
0.203
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X 5”
NOTE
0.058 ”MI N 5”
0.05
5”
MI N 5”
www.mccsemi.com
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