UPC4570 View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
UPC4570 Datasheet PDF : 12 Pages
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µPC4570
RECOMMENDED SOLDERING CONDITIONS
The µPC4570 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µPC4570G2, µPC4570G2(5): 8-pin plastic SOP (5.72 mm (225))
Process
Conditions
Infrared Ray Reflow
Vapor Phase Soldering
Peak temperature: 230°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
Wave Soldering
Partial Heating Method
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC4570C: 8-pin plastic DIP (7.62 mm (300)) , µPC4570HA: 9-pin plastic slim SIP
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
Data Sheet G10528EJ7V0DS
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